微區(qū)XRF(X射線分析顯微鏡)用于電子工業(yè)的品質(zhì)控制和缺陷分析
The unrivalled 10 m spatial resolution of the
XGT-5000 combined with its high sensitivity to the
transition elements makes this energy dispersive
x-ray fluorescence (EDXRF) system an ideal tool
for fast and accurate analysis of electronic
components during the different steps of production
(R&D, trouble shooting, quality control,
WEEE/RoHS directive compliance).
The high intensity x-ray beam used gives much
deeper penetration depths than those achieved
with SEM-EDX (scanning electron microscopy with
energy dispersive x-ray analysis). The penetrative
analysis of XRF associated with transmitted x-ray
imaging allows the non-destructive analysis of chips
embedded within resin. Moreover the beam
emerging from the mono-capillary x-ray guide tube
(the XGT) has optimised collimation which
preserves the 10 m spatial resolution even if the
sample is not in perfect focus.
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