ESPOO, Finland, 28th May, 2014 Picosun Oy, the leading manufacturer of high quality Atomic Layer Deposition (ALD) equipment for global industries, now offers new industrial ALD processes for copper and niobium oxide. Ultra-thin copper films with the highest level of uniformity and conformality only ALD can offer as a thin film deposition method are a crucial element in todays and futures microelectronics and MEMS (microelectromechanical sensors) manufacturing. Copper metallization and seed layers are needed in e.g. microprocessors and 3D-integrated microelectronic components as interconnects. Niobium oxide (Nb2O5), on the other hand, is ideal for moisture and corrosion protection due to its hardness and chemical resistance.